Advanced Package Development Engineer

You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up, CAD tool bring-up and related areas.

Minimum Qualifications BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications 10 years in a Si fab integration role with 5 years in advanced packaging, preferred. PhD in Physics, EE, Mech E, Chemistry, and related fields. Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch µ-bumps, hybrid bonds, TSVs, etc. Deep knowledge of electrical, mechanical and thermal properties of fab materials Strong expertise in Si Fab equipment and Fab Logistics Management Experience on advanced packaging for leading edge CMOS nodes Expertise on Si structure yield and reliability mechanisms and analyses Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT Capable of independent R&D Work in a cross-functional team, driving vendors Excellent communication and people skills

• Package design and design flow development for advanced packaging technologies in a cross-functional team
• advanced packaging CAD flow set-up
• CAD tool bring-up and related areas

• BS and 10+ years of experience in relevant industry experience
• 10 years in a Si fab integration role with 5 years in advanced packaging, preferred
• PhD in Physics, EE, Mech E, Chemistry, and related fields
• Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch µ-bumps, hybrid bonds, TSVs, etc.
• Deep knowledge of electrical, mechanical and thermal properties of fab materials
• Strong expertise in Si Fab equipment and Fab Logistics Management
• Experience on advanced packaging for leading edge CMOS nodes
• Expertise on Si structure yield and reliability mechanisms and analyses
• Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
• Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
• Capable of independent R&D Work in a cross-functional team, driving vendors
• Excellent communication and people skills

• Comprehensive medical and dental coverage
• retirement benefits
• a range of discounted products and free services
• reimbursement for certain educational expenses — including tuition

Can you imagine the pride of having your handiwork being in the hands of a billion people all over the World? That’s the pride of working at Apple, a company that has consistently brought ground-breaking technologies to the average consumer, enabling just about anybody to carry a high performance computer in their pocket. If you are motivated by creating advanced technologies that enhance lives everywhere, if you have unwavering focus on excellence in your craft and if you are all about being deep in the technical details, then we are looking for you! Bring your technology skills and self-motivation to your job here and be prepared for an adventure! This position will support Apple’s Advanced Packaging Program with responsibilities for package integration and technology development.